The photonic process expert for advanced packaging

In the future, light will evolve

DEUVtek builds precision laser process and metrology systems for advanced packaging and compound semiconductor industries.

Every breakthrough,
machines give way to light.

We design the beam · execute the process · verify the result.

Sawing became laser dicing. Grinding is becoming laser thinning. Drilling is becoming DOE-shaped via formation. One closed loop — from beam design through processing to 3D NIR verification — a control depth that neither pure tool vendors nor pure metrology vendors can offer.

±0.1 µmPosition accuracy
<0.01%Wafer breakage rate
30 µmUltra-thin wafers
>20 WPHThroughput
01 · About DEUVtek

Built by semiconductor specialists

“Precision is not a number on a datasheet — it is a discipline built into every optic, every motion, every habit. That discipline is what we brought from Japan to DEUVtek.”
SS
Shoichi Sakanishi
Chairman / CEO · ex-Gigaphoton Taiwan Chairman
“We aim to be a system-level force in the reorganization of the global semiconductor supply chain — not a single equipment vendor.”
JY
Dr. Jun-Yi Chyan
COO · ex-GlobalWafers Chief Technical Lead
02 · Core Competency

Advanced Design and Integration

Metasurface DOE Design

Proprietary metasurface and diffractive optics — command of beam and via geometry above every process.

Packaging Process Know-How

Validated process windows for drilling, cutting, and thinning — in glass, SiC, and beyond.

Equipment Integration & Development

From optical engine to full tool — in-house integration of laser, motion, and OCT inspection, automation-ready.

03 · Applications

Focused on advanced packaging performance

04 · Products

What we make with light

GlassForge

DOE-embedded glass substrate & waveguide assembly

DOE-embedded glass-based substrate and waveguide assembly for CPO coupling — formed, cut, and 100% OCT-verified on our own line.

GlassForge glass substrate

Phalanx

Laser process & inspection equipment

Phalanx-series laser process tools and 3D NIR OCT inspection systems — certification and automation integration included.

Phalanx laser equipment
05 · Sustainability
Higher yield. Lower footprint.
Efficiency

Less energy per wafer

Photonic processing replaces energy-hungry mechanical steps — minutes instead of hours, watts instead of consumable-driven kilowatts.

Yield

Less material wasted

Breakage cut from ~3% to <0.01% — every wafer saved is embodied energy, water, and carbon that never has to be spent twice.

Consumable-Free

Zero consumables in the process

Photonic processing uses no diamond wheels, no slurry, no cleaning chemistry — nothing consumed, nothing sent to waste treatment.

Contact

Evaluation lots, foundry quotations, development projects, partnerships — or joining the team. One form, routed to the right people.

DEUVtek Co., Ltd.
Zhongli Lab
1F.-5, No. 192, Zhongyuan Rd., Zhongli Dist., Taoyuan 32063 (Zhongli Industrial Park)
Taipei Office
3F., No. 15, Sec. 1, Nanjing E. Rd., Zhongshan Dist., Taipei 104010

service@deuvtek.com
+886-2-7750-6246

NDA-first for technical discussions · we reply within 2 business days